MAX5890EGK+D【PDF 9/16 页】IC DAC 14BIT LVDS 600MSPS 68-QFN

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Sheet目录2011

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MAX5890

14-Bit, 600Msps, High-Dynamic-Performance

DAC with LVDS Inputs

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference VREFIO = 1.2V, output load 50

double-terminat-

ed, transformer-coupled output, IOUT = 20mA, TA = -40°C to +85°C, unless otherwise noted. Specifications at TA

≥ +25°C are guar-

anteed by production testing. Specifications at TA < +25°C are guaranteed by design and characterization. Typical values are at TA

= +25°C.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

AVDD1.8, DVDD1.8 to AGND, DGND, DACREF,

and CGND.......................................................-0.3V to +2.16V

AVDD3.3, DVDD3.3, AVCLK to AGND, DGND,

DACREF, and CGND.........................................-0.3V to +3.9V

REFIO, FSADJ to AGND, DACREF,

DGND, and CGND ..........................-0.3V to (AVDD3.3 + 0.3V)

OUTP, OUTN to AGND, DGND, DACREF,

and CGND .......................................-1.2V to (AVDD3.3 + 0.3V)

CLKP, CLKN to AGND, DGND, DACREF,

and CGND..........................................-0.3V to (AVCLK + 0.3V)

PD to AGND, DGND, DACREF,

and CGND.......................................-0.3V to (DVDD3.3 + 0.3V)

Digital Data Inputs (D0N–D13N, D0P–D13P) to AGND,

DGND, DACREF, and CGND ..........-0.3V to (DVDD1.8 + 0.3V)

Continuous Power Dissipation (TA = +70°C) (Note 1)

68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW

Thermal Resistance

θJA (Note 1) ....................................24°C/W

Operating Temperature Range ..........................-40°C to +85°C

Junction Temperature .....................................................+150°C

Storage Temperature Range ............................-60°C to +150°C

Lead Temperature (soldering, 10s) ................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

STATIC PERFORMANCE

Resolution

Bits

Integral Nonlinearity

INL

Measured differentially

±1

LSB

Differential Nonlinearity

DNL

Measured differentially

±0.5

LSB

Offset Error

-0.02

±0.001

+0.02

%FS

Full-Scale Gain Error

GEFS

External reference

-4

±1

%FS

Internal reference

±130

Gain-Drift Tempco

External reference

±100

ppm/

°C

Full-Scale Output Current

IOUT

220

Output Compliance

Single-ended

-1.0

+1.1

Output Resistance

ROUT

Output Capacitance

COUT

5pF

Output Leakage Current

PD = high, power-down mode

±1A

DYNAMIC PERFORMANCE

Maximum DAC Update Rate

600

Msps

Minimum DAC Update Rate

Msps

fOUT = 36MHz

AFULL-SCALE = -3.5dBm

-162

Noise Spectral Density

fCLK = 500MHz,

-12dBFS, 20MHz

offset from the

carrier

fOUT = 151MHz

AFULL-SCALE = -6.4dBm

-153

dBFS/Hz

Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed-paddle area.

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